Structural Characterization of 2.5D System in Package Combined with High Bandwidth Memory for Enhanced Quality and Reliability

2.5D body size is expanding due to SoC/HBM system integration to maximize artificial intelligence (AI) performance. Accordingly, thermal and mechanical stress caused by large body size is also increasing. In this paper, we performed a process and reliability evaluation that simulates 2.5D SiP (System-in-Package) assembly from three perspectives: effect of side mold width, top die immunity test, and molded underfill (MUF) degradation test. It is proven that HBM (high bandwidth memory) products with mass reflow (MR) bonding with molded underfill process are superior in the evaluation results of the 2.5D SiP level. The results of mechanical simulation, point indentation test, and reliability test on samples subjected to high temperature and high pressure will be discussed in detail.