Transcending the Reticle Limit in On-Wafer Die Integration and Advanced Packaging: Full-Wafer Patterning with High-Productivity Electron Beam Lithography

The semiconductor industry is experiencing a transformative phase driven by the adoption of AI, purpose-built hardware in data centers, high-performance computing, and edge computing. However, traditional lithographic scaling of transistors is facing diminishing returns in performance improvements. Chip designs are nearing or surpassing the maximum size of a single scanner field, presenting a challenge for manufacturers. Chiplet integration emerges as a solution, breaking down complex chips into modular chiplets for enhanced flexibility, yield, economics, and scalability. Advanced packaging technologies play a crucial role in enabling seamless inter-chiplet communication. Multibeam Corporation's Multicolumn Electron Beam Lithography (MEBL) system offers a solution for patterning substrates in large multi-chip module assemblies, revolutionizing direct-write patterning systems with high productivity. This paper explores how MEBL is creating game-changing improvements in wafer-scale interposers (up to >80× larger), adaptive patterning (>10× higher bandwidth), and on-wafer die-die stitching (stitched die transcending reticle limit, with >98% energy reduction per bit transfer). These innovations enable unmatched performance, cost, and scalability, driving innovations in advanced integration of chips.