Thermal Management of 6-in-1 SiC Power Module with Double-Sided Impingement Cooling

Driven by growing demand for high power, versatile function, and compact structure in power electronics, thermal issues become more severe and complex. For higher efficiency and constrained space, a double-sided impingement cooling solution has been designed, fabricated and characterized for 6-in-1 SiC inverter module. CFD simulations have been performed, and 6 groups of nozzle array have been designed to handle 6 SiC chips at different locations. The width of the cooling plate is limited to be 20mm for system integration. High cooling efficiency has been achieved by forming direct array impingement from both sides of the power module. The simulation design has been well correlated with experimental tests. With the developed thermal management solution, to dissipate total heating power 900W of the module, chip heat flux 600W/cm
²
, the maximum chip temperature rise is less than 100℃, and peak temperature difference is around 7℃, while keeping stable cooling operation with low energy requirement.