Prediction of Moisture Absorption Characteristics under Normal/Accelerated Preconditioning Condition in Multi Chip Packages

The main objective of this research is to predict the moisture absorption characteristics under normal and accelerated preconditioning in multi-chip packages. Experiments and numerical simulations were performed to quantitatively evaluate cumulative moisture absorption. The internal moisture absorption distribution and the hygroscopic stress at a specific time is also presented. This paper aims to predict moisture absorption characteristics by analyzing the cumulative moisture absorption over time of multi-chip packages. To achieve this goal, experiments were conducted to evaluate the cumulative moisture absorption over time under the normal and accelerated condition in 4-stack and 16-stack packages. Numerical simulation was performed under the same conditions as the experiment to validate the experimental data. Equivalent acceleration time results were predicted to be 35 hr and 34.6 hr in experiment and simulation, respectively, in the 4- stack package. Also, it was individually analyzed as 45.2hr and 49hr in the 16-stack package. These studies can be used to analyze the defect due to moisture absorption in various packages.