Glass Panel Process Integrated Low Stress Organic Dielectric RDL Structure

In this paper, we introduce a new organic dielectric redistributed line (RDL) fabrication method by using hybrid bonding (LTHBI) technology integrated on glass panel level process (PLP). This technology is based on creating a low-layer-count and fine-pitch RDL structure via the semi-additive process (SAP) on separated panel glass carriers. Then a higher-layer-count RDL can be subsequently assembled by using a hybrid bonding process at less than 200°C. For the novel process flow, we called it as "Hyper RDL®" or HRDL®. The utilization of low-temperature hybrid bonding for the RDL introduces a substantial reduction in accumulated stress during the process, thereby mitigating issues related to warpage.