Development of Next-Generation Chemical Mechanical Planarization Process for Panel-level Heterogeneous Integration

The integration of large die complex on panel scale requires significant manufacturing technology development with thickness variation control as a key enabler for pitch scaling and redistribution layers (RDLs) with ultra high-density routing. This paper will focus on CMP process development for very large form factor panel-scale (510x515 mm) The magnitude and panel-level uniformity of removal rate are optimized across various materials, slurries, pads, and process parameters. Capabilities for reducing total thickness variation (TTV) are also demonstrated on substrate dielectric layers and on a bridge die interconnect substrate.