Novel low loss polymer with high thermal resistance for advanced IC packaging

As 5G/6G wireless communications are adopted throughput the industry, IC-Substrate and Printed Circuit Board (PCB) designs require new materials with low signal loss at high frequency applications. Among a wide variety of materials used, development of a low loss polymer designed to balance mechanical properties, electrical performance, and adhesion is required. This paper introduces a new thermoset polymer with low dielectric constant (2.6 at 10GHz) and low dissipation factor (0.0011 at 10GHz) for low loss dielectric applications. It also offers superior electrical properties even at the high temperature storage test (150°C/500h). The paper also discusses different frequency (36 to 100GHz) and temperature (-30 to 100°C) impact on electrical properties of the test matrix. The results indicate that the material maintains electrical properties, with minimal signal losses with high frequency applications.