Signal, Power and Thermal Co-optimization Methodology for FPGA Advanced Package

In this paper, signal integrity (SI) performance has been investigated for advanced interconnect bridge on organic package (AIBO) technology. Performance comparison under various conditions-conductor roughness change, layers of routing, temperature difference has been conducted. This paper also introduces package power integrity (PI) analysis including DC IR drop, AC voltage droop studies and optimizations for advanced package. Power integrity (PI) challenges for high current consumption of FPGAs’ core power rail are analyzed and enablement solutions on package level are proposed to meet noise specifications without additional costs. Under high power and high current condition, thermal integrity issue has been raised and temperature map is obtained to identify the hotspot on a package design.All these studies are essential to guarantee a successful package design to meet requirements of intensive computing, high data rate, low latency, higher current consumption working environments the new artificial intelligence (AI) era brings in.