Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications

Heterogeneous and homogenous integration with advanced packaging has recently been the subject of intensive discussion and development to pursue optimum electronic system performance. The concept of miniaturized systems is particularly important for mobile applications, such as demands for more integrated functionality, better electrical performances and smaller form factors. Fan out wafer level package (FOWLP) of advanced packaging technologies is one of the latest technologies to meet the requirements of smaller form-factor and higher performance for mobile applications. In this paper, an innovative vertical fan out (VFO) package has been introduced as the next generation platform based on FOWLP that will be considered with better thermal, mechanical, and electrical performances than current memory packages in fine pitch ball grid array (FBGA). VFO had unique features of vertical wires on reconstructing stacked dies and multiple redistributions (RDLs) with a simple manufacturing process. It had a thinner z-height of 27% less than FBGA by elimination of organic substrates. Mechanical, electrical and electromagnetic Interference (EMI) characteristics of a package were evaluated. In addition, board level reliability (BLR) Drop, temperature cycling (TC) and package reliability were evaluated.