Fluidic Self Alignment for Hybrid Bonding Using Intel Process

Scaling of die-to-wafer hybrid bonding to realize finer interconnects and greater disaggregation requires new solutions for fast bonding with precise alignment. This paper presents fluidic self alignment as a promising approach that can enable better alignment than today’s solutions with over 10x increase in throughput. Modeling is carried out to quantify the physics, and a new Intel process is developed to fabricate wafers with self alignment features, demonstrating successful liquid confinement. This is followed by assembly experiments which bring down the die-to-wafer misalignment from over 50 um to less than 0.2 um after fluidic self alignment at specific conditions. Next steps to improve the modeling and the process are outlined.