Characterization of 224 Gbps/lambda Interconnects in Co-Packaged Optics for Hyperscale Data Centers and AI/ML Clusters

In this work, interconnects between Optical Engine (OE) and switch in a Co-Packaged Optics (CPO) architecture are characterized. The OE is fabricated in Fan-Out Wafer Level Package (FOWLP) with vertical interconnects Through Mold Via (TMV) routing the signals from the frontside of FOWLP to backside and then to the package substrate RDL which connects the switch. RF performance of TMV interconnects is characterized with double-side prober which directly measure the frontside and backside of TMV interconnects. The full signal path from OE to switch is characterized and PAM4 eye diagrams at 112Gbps and 224Gbps are generated with clear eye openings.