Fabricating Copper Probe Tips for Vertical Probe Card Using Electroplating and Photolithography

As circuit testing becomes more complex, streamlining the fabrication of probe tips becomes increasingly valuable, especially in densely arranged arrays. This paper presents a process for fabricating copper probe tips on a vertical probe card. The technique involves creating a photoresist mold to define the shape of the tips, followed by an electroplating process. The described method offers an efficient approach to create 6μm tall copper probe tips with a tip pitch of 24μD.