Fabrication of Tungsten Probe Tips on a Silicon Carbide Probe Card

This work presents a process for fabricating tungsten probe tips on a vertical silicon carbide-based probe card. The intended purpose of this device is for small-circuit assessment and verification under cryogenic temperatures. Fabrication of tungsten probe tips involves the deposition of a tungsten layer, photolithography, and wet etching. Probe tips were fabricated with heights up to 5 micrometers and diameters of between 1 and 13 micrometers.