A Ka- to W-Band Tightly Coupled Array Antenna-in-Package Using Glass IPD for Ultrawideband mmWave Wireless Communication

This paper presents the broadband communication capability of a millimeter-wave (mmWave) ultrawideband tightly coupled array (TCA) antenna based on high-density interconnect (HDI) antenna-in-package (AiP) technology. The essential antenna array elements are crafted using glass-based integrated passive devices (IPDs) and are subsequently flip-chipped on a multilayered HDI printed circuit board (PCB). The antenna features a wide impedance bandwidth from Ka- to W-band, suiting applications that demand a large signal bandwidth.