Ways to Improve Efficiency of Heat Exchange and Optimize Heat Removal in Radio-Electronic Equipment

The analysis given aimed at studying the impact of bonding pad size on heat removal. Heat removal is a crucial aspect in the development and upgrade of electronic devices because it affects their reliability, resilience, and efficiency under the impact of various external factors. The research was conducted through numerical modeling in the ANSYS software package (the Icepak module) to calculate the thermal modes depending on the size of the bonding pad. The authors provide the results of the mathematical modeling and analytical calculations for several bonding pad sizes performed in the software mentioned. The obtained results of the thermal mode calculation showed the configuration that could best improve the efficiency of heat exchange and provide its optimization for various radio-electronic equipment.