A Low-Cost Chip to Waveguide Transition for W-band Wireless Transmission with Wire-Bonding

This paper presents a low-cost chip to waveguide transition for W-band wireless transmission. The wideband tran-sition between rectangular waveguide and substrate-integrated waveguide (SIW) is realized by an SIW-fed cavity-backed patch antenna. On-chip ground-signal-ground (GSG) pads to SIW transition is then investigated by a compensated wire-bonding network with a grounded coplanar waveguide (GCPW). The full transition is demonstrated by a W -band SiGe transmitter with an average of 3 dB loss within 75–100 GHz frequency range compared to on-wafer measurement results.