Multiport 3-D Interconnection Based on Substrate-Integrated Waveguide

In this article, a four-port 3-D interconnection based on substrate-integrated waveguide (SIW) with two independent paths is proposed. It is assembled by two dielectric substrates vertical to each other, which can satisfy the demand of 3-D interconnect with two input–output ports. According to the parameter and sensitivity analysis, the design method and modified fabrication method are proposed. Two kinds of topology of multiport 3-D interconnection composed of several four-port 3-D interconnection side by side are given to obtain good performance in more complex, irregular, and larger scale multiport connection. In addition, the expand style of the four-port 3-D interconnection which is called the eight-port 3-D interconnection with two different topologies is proposed. It has the advantages of high integration and is suitable for larger scale multiport connection. These 3-D interconnections are fabricated and measured to verify the design method. The transmission performance and amplified–phase consistency between paths are good with 22% bandwidth. Therefore, these different kinds of 3-D interconnections can be applied in the cases of 3-D multiport connection with the property of various topologies, irregular or large scale.