Enabling AI Revolution Through Innovations in Advanced Packaging & Chiplet Technology

Chiplet architectures and advanced packaging, spearheaded by 3.5D integration in AMD's MI300x, have become paramount for sustaining power-efficient growth in AI and edge computing. As Moore's Law slows, these technologies push the envelope of performance, offering unique product capabilities unavailable through monolithic integration. This talk delves into intricacies of heterogeneous architectures like 2.5D, 3D and 3.5D architectures, showcasing how AMD's industry-leading roadmap leverages them to achieve optimal power, performance, area, and cost (PPAC). We will also highlight specific chiplet modularity and design enablement in MI300x, specifically addressing the architecture, power and thermal management challenges and solutions associated with large chiplet modules.