DC Flashover in Printed Circuit Boards at Low Gas Pressures: Mechanism and Mitigation Recommendations

PCB layouts with different polygon shapes and insulation distances were prepared and their surface flashover voltage subjected to different ramping rates were measured at different temperatures and different low gas pressures for emulated high-altitude conditions. The dependence of the surface flashover voltage on effects of gas pressure, surface insulation distance, temperature, and polygon shape was studied. Modulation efforts which include tailoring the local surface conductivity and local topography modification were performed to increase the flashover of PCB, and the related mechanism was studied. The results showed that the voltage ramping rate plays an important role in determining flashover voltage. The flashover voltage is lower when the sample is subjected to a rapid voltage ramping rate than with a slow ramping rate. This phenomenon is more prominent towards ambient pressure. The increase in temperature results in a decrease in flashover voltage at 100 kPa, while at 20 kPa and 10 kPa, the influence of temperature on flashover becomes less significant. Through-holes designed in the PCB have a positive role in increasing flashover voltage at lower pressures. However, at 100 kPa, the holes no longer contribute to any higher flashover voltage. Modification of local surface conductivity has no contribution in increasing the flashover voltage, while a surface coating with a surface conductivity of
$10^{-10}$
S dramatically decreases the flashover voltage. The work presented in this paper provides a reference for the design and modification of PCB layouts for use in future aerospace hybrid propulsion systems.