Segmented Cavity Design for Suppression of Cavity-to-Via Coupling in High-Speed Transmission Lines of Multi-Layer Printed Circuit Boards

This paper proposes a segmented cavity structure designed to enable high-speed signal transmission in high-aspect-ratio multi-layer printed circuit boards (MLPCBs). The proposed structure is designed to suppress group cavity resonance, a phenomenon that couples with signal vias as they transition between layers and causes broadband signal degradation in high-speed transmission lines. The proposed design structures were validated through 3-dimensional electromagnetic field simulation, demonstrating improved signal integrity performance.