Investigations on Component Attachment Process and Noise Sustain Mechanism in Quad Channel High Gain Phase Matched Receiver

A component attachment process and noise sustain mechanism have been proposed in this article to realize a quad channel high gain phase-matched receiver. A critical issue in the conventional soldering process is the formation of unwanted voids beneath the component which affects gain and phase performances of the system under consideration at microwave frequencies. Assembly conditions and process sequence followed by bonding process for oscillation-free flat gain, low noise figure (NF), and sustain phase noise performance are selected to ensure less than 2% void formation. Vapor phase assembly (VPA) at 250° is performed in case of longer RF track PCBs for avoidance of any phase mismatch. Experimentations on assembly conditions, number of bonding stands, and bond wire thickness are carried out for multiple trails respectively. In each step, X-ray scan reports and monitored performance results have been analyzed to set checkpoints in the complete development process. Finally, gain, NF, and phase noise responses of developed multichannel receivers have been analyzed. Multichannel pulse repetition time (PRT) controlled microwave module has been realized and tested over thermal screening for several cycles and performed random vibration (RV) test to validate the proposed component attachment process. Electrical parameter results achieved using proposed techniques have been compared with conventional method results in this article. The proposed component attachment process is equally applicable to the realization of any other RF circuit design to be operated under ambient conditions and harsh environments.