Kinetics on Dynamic Percolation of Carbon-Nanotube-Filled Electrically Conductive Pastes Depending on Binder Chemistry

This work investigated the electrical conductivity development of carbon-nanotube-filled conductive pastes composed of several epoxy resin-based binders during curing. Applying aliphatic epoxy-based binders accelerates the electrical conductivity development more than aromatic epoxy-based ones. The conductive pastes composed of the aliphatic epoxy resins exhibit a low electrical resistivity of
$\sim10^{-2} \Omega \text{cm}$
, almost equal to the interfacial electrical resistivity at the direct contact between the fillers. The electrical conductivity development is further accelerated by partially substituting the main epoxy resin with a reactive diluent. The binder chemistry can control the kinetics of the dynamic percolation of the conductive pastes.