Thermal Cycle Reliability of BGA Package With Board-Level Underfill Materials

This study examines the thermal fatigue life of BGA(Ball Grid Array) based on the characteristics of underfill materials through experiments and simulations. Non underfill, high Tg(glass transition temperature), medium Tg and low Tg underfill were introduced, taking into consideration the thermal characteristics of each underfill material. Additionally, the study investigated the failure modes of BGA solder joints concerning the with and without underfill by analyzing cross-sectional analysis and EBSD analysis. The results address how the underfill influence on the reliability and failure of solder joints. These investigations contribute to enhancing the stability of solder joints with underfill materials in automotive application.