Approach for Advanced Packaging for 2.5D/3D Chiplets

This paper introduces a novel approach for processing advanced packages, e.g., 2.5D/3D devices, with compression molding MUF. With our unique molding structure, we are able to completely fill narrow gaps with resin without any entrapment voids. The proposed technology is dependent on having an evenly distributed resin layer for a uniform resin curing and minimalized resin flow, as well as establishing a high degassing vacuum within the mold chase. In addition to improved device reliability, reduced processing cost can also be achieved using this new technology.