Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C

Advances in AI technology, including generative AI, have increased the level of requirements for semiconductor materials and manufacturing technology to transmit vast amounts of information at high speed. In particular, the technology for bonding copper electrodes directly involved in information transmission is difficult to handle with traditional solder bonding technology due to the requirement for narrower pitch, and a new bonding technology is required. Recently, hybrid bonding technology has been developed, in which direct copper-copper bonding is performed without using bonding materials. However, hybrid bonding has two challenges: a small margin for particles at the bonding interface and a high bonding temperature of 300-400°C. In this study, polymer hybrid bonding has been developed using photosensitive resin, an organic material, for the insulating layer and copper sintering paste for the copper electrode. Photosensitive adhesives can flow during bonding, which can suppress voids and improve bonding defects. Furthermore, copper sintering paste can be bonded at I ess than 250°C, enabling copper-copper bonding at low temperatures.