HAZ-free Direct Laser Machining on Silicone-Based Flexible Hybrid Electronics

Silicone rubber as a wide spread material with high thermal/chemical stability yet high mechanical flexibility and play an important role in emerging flexible hybrid electronics of bio-medical device and deformable IoT units. However, limited direct fabrication method was provided with low fabrication speed and poor quality after either machining and chemical etching. In this study, ultrashort pulse laser utilized for high fabrication performance with high quality was proposed and demonstration on FHE was realized as well.