Bi Segregation in the Solid/Liquid Cu-0.1 wt.% Fe (C19210)/Sn-58Bi Solder

The effect of minor element of Fe in Cu-based substrate (C19210) in molten Sn-58Bi solder in case of Bi segregation has been investigated. The findings are focused on observing the morphology located on Cu-Sn/substrate where segregation often occurs which can cause reduction in mechanical joints. Characterization results such as scanning electron microscope (SEM) and energy dispersive spectrometer (EDS) will be discussed in this study. The results show that there is a slowdown in the growth of Cu3Sn in solid/liquid C19210/Sn-58Bi couples. In this study, 0.11 wt.% Fe in C19210 hinders Cu
3
Sn growth in solid liquid C19210/Sn-58Bi couples. The Cu
3
Sn inhibition also affects Bi segregation thus the minor effect of Fe on the substrate effectively reduces the impact of decreasing mechanical properties.