Investigation into the Impact of Layout Design on Thermal Performance in Embedded-Die Packages

The market for embedded die has experienced significant growth over the past several years, making it the fastest-growing packaging technology. This growth is driven by factors such as smaller form factors, improved heat dissipation, higher levels of integration, and lower noise emission, resulting in better performance. In addition, embedded technology has been assessed for mobile-wireless and power management applications as an alternative to assembled fabrication, providing the potential for thinner thickness and superior thermal performance. In this study, a three-dimensional finite volume method was developed and experimentally validated to simulate the thermal behavior of the solder ball within the package. The thermal analysis results indicate a trace layout issue between the package and PCB board, which could affect reliability and manufacturability. To create an actual sample, a design ruler was used to measure the differences between simulation and experiment. The measured thermal data closely aligns with the predicted data, with a maximum deviation of only 4.35%. The results of the simulation analysis suggest that the advanced package structure design mentioned above would improve Theta JA due to enhanced thermal dissipation behaviors attributed to the embedded die structure design and the acceptable layout of hot spot locations. A new embedded die layout can improve thermal performance by approximately 8.1%.