Advanced TIM Material Analysis for High Performance Package Applications

High-power semiconductor applications require thermal interface materials (TIMs) with higher thermal conductivity to effectively release the heat generated by high-speed transmission devices. In this article, we measured a new epoxy-based TIM with silver fillers, which has large differences from normal silicone-based TIMs. This epoxy-base TIM has higher conductivity (18 W/mK) and strong adhesion strength. Since higher modulus affects TIM coverage performance, soft elastomers, stress relief agents, and more specifically core-shell fillers are added to the material. In this article, we introduce how to measure TIM material properties using each method. After package assembly, we have the quality inspection by SAT and SEM. Compared with previous testing experience, the performance of this new epoxy-based TIM has been significantly improved. The next follow-up is that TIM material needs some adjudge to improve TIM coverage.