Hybrid Numerical Simulation for Capillary Underfill Flow Over a Fine Pitch HBM Packaging

We present a hybrid numerical model designed for simulating underfill flow behavior in fine pitch High Bandwidth Memory (HBM) packaging. This innovative model integrates reduced order modeling to accurately replicate the drag/driving force induced by micro bumps, bypassing the need to resolve intricate geometric configurations while generating domain mesh. This approach enhances computational efficiency while maintaining precision, addressing challenges posed by the growing demand for increased solder bumps in semiconductor packaging. The proposed model offers a streamlined yet accurate solution for studying underfill dynamics, particularly in scenarios with highly dense micro bumps, contributing to advancements in semiconductor packaging simulations.