Study of Galvanic Effect Factor and Mechanism for Ni/Au Plated Substrate

In this study, the non-plating line (NPL) of NiAu plated is the highest risk of Galvanic effect, and solder mask / Au-Cu junction are the influencing factors. Combine the above Galvanic factors and process verification results, Au/Cu ratio formula can be defined to avoid high risk design and to increase process stability.