Characterization of the Silicone Gel Package Insulation’s Microscopic Pyrolysis Kinetics and Remaining Life Evaluation Technique

A significant research challenge is determining how to best assess the ageing status and remaining life of the package insulation of IGBT devices. Thermodynamic analysis can provide a novel technical approach to evaluate package insulation. In this paper, a new model of microscopic pyrolysis kinetic characterization of package insulation is established, and it is found that the residual life assessment is mainly related to three factors, namely, temperature integral P(u), activation energy E, and thermal breakdown temperature of insulation $T_{f}$. Next, an algorithm is provided for effectively addressing the three model factors. The experimental findings suggest that the activation energy is 123.3kJ/mol using the modified Flynn-Wall-Ozawa method. The silicone gel sample’s insulation failure temperature is 453°C according to the micro-determination method. The evaluation’s findings demonstrate that temperature has a greater impact on package insulation, with a 60% decrease in insulation life occurring for every 10°C increase in operating temperature. This paper builds the methodological groundwork for the prediction of the remaining lifespan of package insulation from the standpoint of pyrolysis kinetics.