Effect of Green Additive Sarcosine as Inhibitor for Cobalt-Based Copper Interconnect CMP

Chemical mechanical polishing (CMP) is one of the most effective methods to achieve atomic-scale smooth surface. Each component of the slurry plays an important role in the CMP process. The effect of sarcosine as inhibitors for cobalt-based Cu interconnected CMP was studied in this article. And its mechanism of action was analyzed by electrochemical experiments and atom force microscope (AFM).