High-Resolution Time Domain Reflectometry in Advanced Package Failure Analysis

With the rapid development of advanced packaging, various 2.5D and 3D packaging methods have emerged, including SiP, CoWoS, TSV, PoP and more. The failure in wiring and bonding structures of advanced packaging is detectable at a precision level of less than a hundred micrometer. To address open and short failures in advanced packages, high-resolution Time Domain Reflectometry has been implemented. This technique utilizes laser technology to generate high-frequency Terahertz pulses, enabling a thorough analysis of failure locations with a remarkable $5\mu \mathrm{m}$ resolution.