System Reliability

Summary

Complex deep sub‐micron (DSM) components are expected to operate under harsh conditions depending on their mission profiles. The reliability is required to be described by adequate models to estimate the failure probabilities and appropriate distributions. This chapter considers the formula for the reliability of a series system, parallel system, or a mix series/parallel system. The most commonly used model for system reliability assumes that the system is made up of n independent components, all of which must operate in order for the system to function properly. Further details are obtained by studying the Weibull distribution of each group of ring sizes: 3, 5, and 11 inverters. Literature has acknowledged complementary metal‐oxide semiconductor (CMOS) bulk reliability distribution parameters accounting for electrical aging mechanisms, such as high‐temperature degradation, so‐called negative or positive thermal instability (NBTI or PBTI), hot carrier injection (HCI), and the hard or soft breakdown of dielectric gates.