Characterization Methods for Thermal Management Materials

Summary

With the rapid‐developing miniaturization and integration of microelectronics packaging materials, which require good heat dissipation, electrical insulation, and low thermal expansion, the investigations on the microelectronics packaging materials with highly thermal conductivities and excellent thermal stabilities are urgently required. The high efficiency of transferring the heat from inner products to the outside will effectively avoid substantial overheating and prolong their working life. This chapter reviews the commonly used thermally conductive measurement methods and their relative model, equations, and mechanisms, aiming to understand and grasp how to obtain the accurate thermal conductivity via suitable methods. As packaging material, the characterization of other properties, such as electric conductivity and resistivity, microstructure analysis, thermal expansion coefficient, the reliability analysis, and environmental performance evaluation, was also introduced.