2.5D/3D Packaging and Reliability: New Frontiers, Old Paradigms, and Opportunities

3D Packaging and Heterogenous Integration through advanced packaging is necessary to deliver power, performance, area, cost, and time-to-market benefits to remain competitive in the high-performance semiconductor industry. This paper provides a brief overview of new packaging frontiers, established reliability paradigms, and opportunities to address reliability challenges that are amplified by complex heterogeneously integrated 3D packaging architectures using two examples: MI250 and MI300A that power U.S. Department of Energy's Frontier and El Capitan supercomputers.