EDA method to address interconnect reliability and reduce overdesign in custom analog designs

A proper simulation of temperature distributions within the electronic design automation (EDA) flows is quite crucial to achieve both a competitive and reliable design in advanced ICs. This work presents an advanced EDA electromigration methodology that accounts for local device self-heating, inter-device thermal coupling and temperature mission profile. By a verification of an analog RF power amplifier design the benefits of our flow and the impact to
$I_{dc}$
current limit adjustments are demonstrated.