Advanced Sensing Systems Exploiting the Integration of Flexible and Large-Area TFTs with Si-CMOS Technology

This manuscript provides an overview of recent advances in sensing systems built by heterogeneous integration of Flexible and Large-Area electronics with Si-CMOS ICs. This approach enables unprecedented form factors required in e.g., wearable and biomedical applications. However, the integration of different technologies poses important challenges from both the electrical and the manufacturing perspective. Architectural and circuit solutions to overcome some of the main integration hurdles are discussed. Furthermore, three relevant emerging applications are presented.