Design and Realization of Cascaded S Band Power Amplifier on Hybrid Multilayer PCB

In this paper a three stage cascaded S band Power Amplifier(PA) is presented. To create a compact module surface mount matched devices are used. In this design 59dB gain with peak output power of 44dBm(25W) is realized on a hybrid multilayer PCB consisting of Teflon and FR4 core materials. The cascaded PA is designed to achieve optimization of size, weight and power. This design is primarily for transmit section of T/R module in Active Phased Array application. The design is tested for −10°C low temperature to +55°C high temperature environments.