A Real-time Monitoring System for Power Consumption and Junction Temperature of DSP Devices

With the continuous development of chip technology integration, chip heating and power consumption has become a serious problem affecting the system reliability. The chip junction temperature monitoring and increase in power consumption have become very important especially for the DSP chips with low power meter requirements. In this paper, a new measurement method for junction temperature and power consumption of DSP devices is designed based on the CCS platform. It can realize the realtime and accurate monitoring of chip junction temperature and power consumption. A variety of feasibility tests were carried out by varying its temperature stress and the load condition of the MSP430FR5969 chip. The test condition was calibrated and verified with Energy Trace technology, and the power consumption and junction temperature curves under different load conditions were obtained along with the temperature boundary. This method provides an important reference for the reliability research and low power design of DSP chip.