Multi-Dimensional Light Field Manipulation on Diverse Integrated Photonic Platforms

We review advances in multi-dimensional (frequency, time, complex amplitude, polarization, spatial structure) light field manipulation on diverse integrated photonic platforms (silicon, silica, polymer, III-V, metal, fiber). Silicon photonic integrated circuits, femtosecond laser direct writing 3D photonic chips, InP active photonic integrated devices, and metasurfaces for shaping light are demonstrated. Potential applications and future perspectives are discussed.