Understanding the Substrate Effect on De-embedding Structures Fabricated on SOI Wafers Using Electromagnetic Simulation

In this paper, we present the fabrication, characterization, and electromagnetic simulation of open pad test structures on silicon-on-insulator substrates, with an emphasis on the impact of the substrate properties on RF performance. Targeting the design of optimal RF test structures for emerging technologies, we demonstrated that a high-resistivity substrate is essential to minimize losses and parasitic capacitances in RF measurements for technologies using silicon-on-insulator wafers.