TFT‐LCD Module and Package Process

Summary

This chapter describes the back‐end manufacturing processes of thin‐film transistor‐liquid crystal display (TFT‐LCD) modules (LCMs). It introduces in sequence the TFT‐LCD back‐end processes, starting from polarizer attachment to packing for shipment. The back‐end process includes polarizer attachment, chip on film (COF) or chip on glass (COG) bonding, which are called collectively the JI process, module assembly, aging, and packing for shipment. The chapter introduces the representative business models and material flow in LCM manufacturing. Tape automatic bonding (TAB) and chip on glass (COG) are two different processes for bonding driver ICs with the TFT‐LCD cell. Since backlight particles represent one of the major defects of LCD module, cleaning and double‐checking the BLU quality at the beginning of the assembly process is sometimes necessary. The environment cleanness, especially at the stage of combing BLU with LCD cell, is one of the key factors for successful module assembly.