SiP Design and Simulation Platform

Summary

System in Package (SiP) refers to the integration of a system in a package body. Typically, this system requires encapsulating multiple chips able to complete a specific task, such as system‐level package‐integrated CPU, DRAM, Flash and other Integrated Circuit (IC) chips. SiP package is specifically intended for large‐scale, multi‐chip, 3D packaging. Its stereoscopic 3D nature is mainly reflected in the two aspects of chip stacking and substrate cavity. Mentor provides a comprehensive SiP/MCM, advanced package and PCB design and simulation platform. This chapter describes the inheritance and development process of the Mentor SiP design platform and advanced packaging technology. DxDesigner is the schematic input tool in the SiP design platform. Mentor provides a wide range of simulation and verification tools to support SiP design, including signal integrity, power integrity, thermal analysis, and EMI/EMC. HyperLynx Thermal is a thermal analysis tool, allowing the designer to diagnose SiP heat‐related issues at the early design stage.