Design And Validation Of The First Z-Axis Mems Accelerometer With In-Plane Readout

This paper describes a new concept of out-of-plane MEMS accelerometer with an in-plane sensing mechanism based on the new ThELMA-Double fabrication process recently presented by STMicroelectronics. A comprehensive description of the design choices and the advantages of the presented architecture are here reported together with a die level validation. Finally, measurements of the device assembled with a companion ASIC in a Ceramic Land Grid Array package are reported.