200MM Wafer Reconstitution for Sensor Application

Wafer reconstitution is a process of assembling dies from multiple sources onto a wafer by die to wafer placement that allows for further processing of the landing wafer as a standard substrate in the downstream fabrication. This paper reports integrating ASIC dies reconstructed onto a 200mm Si wafer by using wafer reconstitution technique that is developed at imec, proving the feasibility of wafer reconstruction as an integration process flow for various sensor applications.