Post‐Deposition Processing and Device Integration

Summary

GLAD films have been proven compatible with a variety of post‐deposition treatments and integration with different device platforms. This toolbox allows GLAD designers to select materials favourable for good structural control, and then follow up with surface treatments, annealing or morphological modifications to facilitate integration with other processes. Modification of film morphology, composition and crystallinity through annealing treatments is described. Surface modifications such as chemical functionalization and sub‐nanometre conformal coatings via atomic layer deposition are described. The effects of the topographies found in microelectromechanical system devices on GLAD film growth are discussed, and some techniques for integrating GLAD structures into complex device architectures are shown. Capping layers to provide planar surfaces for subsequent layers or lithographic processing are described, as well as the effects of lithographic processing of uncapped films. GLAD films will clump in liquid environments, referred to as the ‘nano‐carpet’ effect. Techniques such as ion milling or critical‐point drying have been developed to control or eliminate clumping. In extreme cases, GLAD structures can be transferred to materials incompatible with GLAD deposition through a single‐ or double‐templating process.