Thermal Characterization of Integrated Circuit Package Considering the Influence of Heat Source Distribution and Heat Sink Package Structure

With the rapid development of electronic integration technology, high integration, high performance and high-power electronic devices are used in various fields. However, the hot spot temperature rise problem that occurs when the power consumption per unit area of the chip increases affects the safe operation of the integrated circuit, and the resulting heat dissipation problem becomes an important consideration for the reliability of the integrated circuit package. Therefore, in this paper, a simplified integrated circuit model is developed for the thermal characteristics of the integrated circuit package, and the finite element method is used to simulate and analyze multiple influencing factors such as different heat sink locations, heat sink numbers, heat sink shapes, and heat sink sizes. The simulation results show that the heat sink is located on the opposite side and the square fins can effectively reduce the hot spot temperature, and this paper also investigates the temperature life of common electronic devices in the market and finds that the maximum temperature of the heat sink solution in this paper is within the normal operating temperature range of electronic devices and can be used in actual production.