Co-simulation Design of RF Front-End Based on Three-Dimensional Vertical Interconnection of BGA

To meet the development requirements of high density, high integration, miniaturization, and multifunctionality of microelectronic products, three-dimensional integration has become a key technology for the next generation of integrated circuits. In this paper, a three-dimensional integrated module for RF front-end working in the frequency band of 8 - 9 GHz is designed. Ball grid array (BGA) is used as the vertical interconnection structure. Through simulation optimization, the BGA structure achieved a return loss better than 24 dB and an insertion loss better than 0.11 dB within the frequency band. The feasibility of the RF front-end three-dimensional integration scheme was verified through co-simulation. The three-dimensional integrated module has a simple structure and good transmission performance, providing a reliable vertical transmission solution for RF microsystems integration.